CN Board Layer: 24 Layers
Board Thickness: 2.4mm
Min. Line Width/Spacing:3.0/3.0mil
Min VIA: 8 mil
Backdrilling
Surface Finish: Immersion Gold
Impedance control
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|
Lay. no |
8 |
Structure |
HDI 3+2+3 |
|
Surface finished |
ENIG |
Min. BGA pitch |
500um |
|
Board thickness |
1.00mm |
Min. SIP/DIP/QFP pitch |
400um |
|
Array size |
9.085”*4.445" |
Material type |
FR4 High TG |
|
Thru via size |
/ |
Min. Pattern design |
100/ 100 um |
|
Microvia size |
0.10 mm |
Lead Free compliance |
Y |
|
special |
Stack via |
||
